WIRING BOARD, MANUFACTURING METHOD THEREOF, BOARD JOINT, MANUFACTURING METHOD THEREOF, AND ELECTRO-OPTIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of making uniform the heights of bumps formed on a wiring pattern, of inspecting an operation check easily, and of easily correcting inconvenience if there occurs the inconvenience on a TFT connected. SOLUTION: The wiring board includes element connection bumps 14a formed at ends of a plurality of wirings 19, the respective element connection bumps 14a disposed and assembled in a connection region of the TFT 13. Outside the connection region of the TFT 13 there are formed corrected element connection bumps 18a conducted with the element connection bumps 14a. Further, it is desired that outside the connection region of a corrected TFT 13a there are formed corrected element inspecting bumps 18b conducted with the corrected element connection bumps 18a. COPYRIGHT: (C)2005,JPO&NCIPI