发明名称 RESIN COMPOSITION AND MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a resin heat-insulating material having a high degree of freedom of appearance and design function and exhibiting high heat-insulating properties even when used in a smaller volume and to provide a film or sheet and a resin foam comprising the same. SOLUTION: The resin composition contains a compound (A) having an absorption maximum in the wavelength range of 760 to 2,000 nm. The molding comprises the resin composition. The molding is exemplified by a film or sheet at least containing a layer of the resin composition, a resin foam prepared by foaming the resin composition, or a composite molding prepared by laminating a molding comprising the resin composition with a molding made therefrom. Compound (A) used is desirably a naphthalocyanine or phthalocyanine compound. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005263822(A) 申请公布日期 2005.09.29
申请号 JP20040073659 申请日期 2004.03.16
申请人 MITSUI CHEMICALS INC 发明人 YAMAMOTO SANEHIRO
分类号 B32B5/32;C08K5/3415;C08L23/00;C08L25/06;C08L75/04;C08L101/00;(IPC1-7):C08L101/00;C08K5/341 主分类号 B32B5/32
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