发明名称 Substrate for biochip
摘要 A substrate having a plurality of recesses, wherein each of the plurality of recesses has a surface, wherein at least part of the surface is coated with a metal film comprising at least one element selected from Au, Ag, Cu and Pd. A biochip substrate comprising: a substrate having at least one recess; and a metal film formed on the at least one recess, wherein the metal film comprises at least one element selected from Au, Ag, Cu and Pd.
申请公布号 US2005214841(A1) 申请公布日期 2005.09.29
申请号 US20050087616 申请日期 2005.03.24
申请人 NAKAMURA KOICHIRO 发明人 NAKAMURA KOICHIRO
分类号 G01N33/53;B01L3/00;C12M1/00;C12M1/34;C12N15/09;C12Q1/68;G01N33/553;G01N37/00;(IPC1-7):C12Q1/68 主分类号 G01N33/53
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