发明名称 |
Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
摘要 |
The present invention provides a pattern forming method characterized in that energy is applied to a surface of a base material including a polyimide having a polymerization initiating moiety in a skeleton thereof to thereby generate an active site on the surface of the base material, and a polymer directly bonded to the base material surface and having at least a group selected from a group consisting of: a polar group; a functional group whose hydrophilicity/hydrophobicity changes, whose structure is changed into a structure that interacts with an electroless plating catalyst or a precursor thereof, or which ceases to interact with an electroless plating catalyst or a precursor thereof in response to heat, acid or radiation; and a polymerizable functional group, is generated in a pattern shape using the active site as a starting point so that a pattern is formed on the surface of the base material.
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申请公布号 |
US2005214693(A1) |
申请公布日期 |
2005.09.29 |
申请号 |
US20050090593 |
申请日期 |
2005.03.28 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
KANO TAKEYOSHI;KAWAMURA KOICHI |
分类号 |
C23C18/16;C23C18/28;G03F7/004;G03F7/031;G03F7/038;G03F7/039;G03F7/095;G03F7/16;G03F7/26;G03F7/40;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):G03F7/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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