| 摘要 |
<P>PROBLEM TO BE SOLVED: To raise the temperature of the bonding material for bonding a semiconductor device sufficiently high in mounting to realize satisfactory mountability. <P>SOLUTION: The semiconductor package 100 is provided with a low-thermal-conductivity plate 110 which covers the total upper area of a heat spreader 108 of the package to suppress heat dissipation from the heat spreader 108 during a reflow process. Therefore, sufficient heat quantity is conducted to solder balls 106 so that the solder balls 106 can be heated to a desired temperature. As a consequence, satisfactory bonding between the semiconductor package 100 and a substrate 112 by the solder balls 106 is realized to make the mountability of the semiconductor package 100 to the substrate 112 satisfactory. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
