CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To realize reduction in size of circuit device and simplify manufacturing processes.

SOLUTION: A method for manufacturing a circuit device, wherein circuits are embedded in an insulating film is provided. The method comprises steps of: adhering a second film to form a concave area 190 by depositing with pressure a film 160 which includes an interlayer insulating film and is provided with a concave area or a through area on a first film with a vacuum adhering method; embedding a material of an element forming member in the condition of paste into the concave area 190 with a scratching means 200 such as a squeezee; and forming an embedding member such as a high dielectric constant member 170 to form a high resistance member which will be used as a resistor 180 or a capacitor by conducting the drying process to such material.

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