| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide uniform heat stress and suitable fusing degree when a thin film and a base material are fused and isolated using laser beam during manufacture of a vertical light emitting diode. <P>SOLUTION: A laser beam array is used as a fusing energy source and irradiation scope of laser beam array is set to become almost equal to the area of a contact surface between thin film waiting for isolation by fusing and a transitional base material. In this case, when the power supply of laser beam array is turned ON, energies of respective laser beams in the array are simultaneously absorbed by a thin film surface. Accordingly, fusing degree of respective portions on the thin film surface becomes uniform considerably and such portions are isolated from the transitional base material. Moreover, since heat stress does not exist at the thin film surface thereof, adhesion with the transitional base material is more suitably isolated uniformly. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
