发明名称 Method for fabricating gate electrodes in a field plate trench transistor, and field plate trench transistor
摘要 A method for fabricating gate electrodes ( 7 ) in a field plate trench transistor ( 1 ) having a cell array with a plurality of trenches ( 3 ) and a plurality of mesa regions ( 8 ) arranged between the trenches comprises the following steps: application of a gate electrode layer ( 7 ) to the cell array in such a way that the gate electrode layer ( 7 ) has depressions within or above the trenches ( 3 ), application of a mask layer ( 10 ) to the cell array, etching-back of the mask layer ( 10 ) in such a way that mask layer residues ( 10 ) remain only within the depressions of the gate electrode layer ( 7 ), and etching-back of the gate electrode layer ( 7 ) using the mask layer residues ( 10 ) as an etching mask in such a way that gate electrode layer residues ( 7 ) remain only within/above the trenches ( 3 ).
申请公布号 US2005215010(A1) 申请公布日期 2005.09.29
申请号 US20050051248 申请日期 2005.02.04
申请人 INFINEON TECHNOLOGIES AG 发明人 HENNINGER RALF;HIRLER FRANZ;HILLER ULI;ROPOHL JAN
分类号 H01L21/336;H01L29/06;H01L29/40;H01L29/423;H01L29/45;H01L29/74;H01L29/78;H01L31/111;(IPC1-7):H01L29/45 主分类号 H01L21/336
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