发明名称 |
Method for fabricating gate electrodes in a field plate trench transistor, and field plate trench transistor |
摘要 |
A method for fabricating gate electrodes ( 7 ) in a field plate trench transistor ( 1 ) having a cell array with a plurality of trenches ( 3 ) and a plurality of mesa regions ( 8 ) arranged between the trenches comprises the following steps: application of a gate electrode layer ( 7 ) to the cell array in such a way that the gate electrode layer ( 7 ) has depressions within or above the trenches ( 3 ), application of a mask layer ( 10 ) to the cell array, etching-back of the mask layer ( 10 ) in such a way that mask layer residues ( 10 ) remain only within the depressions of the gate electrode layer ( 7 ), and etching-back of the gate electrode layer ( 7 ) using the mask layer residues ( 10 ) as an etching mask in such a way that gate electrode layer residues ( 7 ) remain only within/above the trenches ( 3 ).
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申请公布号 |
US2005215010(A1) |
申请公布日期 |
2005.09.29 |
申请号 |
US20050051248 |
申请日期 |
2005.02.04 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
HENNINGER RALF;HIRLER FRANZ;HILLER ULI;ROPOHL JAN |
分类号 |
H01L21/336;H01L29/06;H01L29/40;H01L29/423;H01L29/45;H01L29/74;H01L29/78;H01L31/111;(IPC1-7):H01L29/45 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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