发明名称 Heated medium supplying method and structure for secondary molding of resin molding component
摘要 A hot-air supply structure ( 1 ) comprises a hot air generator ( 20 ) and a housing ( 15 ) formed in the neighborhood of a hot-air inlet ( 81 ) of a molded component M in a die ( 10 ). A nozzle ( 21 ) is formed at the forward end of the hot-air generator, and an ejection port ( 211 b) is formed on the side wall portion of the forward end needle unit ( 211 ) of the nozzle. The housing includes a support hole ( 151 ) in the nozzle, a relief hole ( 152 ), a flow path communication passage ( 153 ) and a bypass ( 154 ). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path ( 8 ) of the molded component through the inlet ( 81 ) and the passage ( 153 ).
申请公布号 US2005212176(A1) 申请公布日期 2005.09.29
申请号 US20050086218 申请日期 2005.03.22
申请人 NASU HIDEHISA;KUROYANAGI AKIRA;ICHIKAWA MASATO;SAHASHI AKIRA 发明人 NASU HIDEHISA;KUROYANAGI AKIRA;ICHIKAWA MASATO;SAHASHI AKIRA
分类号 B29C45/26;B29C45/00;B29C45/14;B29C45/17;B29C45/72;B29C45/73;B29L23/00;(IPC1-7):B29C45/00 主分类号 B29C45/26
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