MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To avoid a resin base from being brought into a state likely to be exfoliated by relaxing stress exerted on an interlayer part of a mother board printed wiring board and an island-shaped circuit-equipped resin base when inflecting the mother board printed wiring board. SOLUTION: A cutout 14 is provided at a portion located around the sticking portion (partial multilayered portion 20) of the single-sided wiring circuit-equipped resin base 21 of the mother board printed wiring board 11, and the cutout A is made to be more easily inflected than the other portion B. COPYRIGHT: (C)2005,JPO&NCIPI