| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board in which high-precision boring can efficiently be performed by obtaining position shift data on a through hole before the printed wiring board is completed and reflecting the data on corrections of boring data of a boring machine. SOLUTION: The method is disclosed for manufacturing the multilayer printed wiring board formed by alternately laminating an insulating layer and a conductor layer. The method is disclosed for manufacturing the multilayer printed wiring board including a stage of forming a test coupon for position shift detection of the through hole for a product before boring, a stage of detecting position shift data of the through hole by using the test coupon, and a stage of performing continuous boring after feeding the position shift data back to the boring machine to correct the boring data. COPYRIGHT: (C)2005,JPO&NCIPI |
