发明名称 |
SILICON SUBSTRATE HAVING MULTI GROOVE SURFACE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon substrate containing a silicon surface layer having a high porosity to such a degree that it could be regarded as a quantum wire with the aid of a dehydrofluorination process. SOLUTION: The manufacturing method of a silicon substrate having a high porosity surface layer comprises a process of uniformly depositing a metal film on at least a part of the silicon substrate; a process of dipping the silicon substrate on which the film is deposited in a processing solution containing at least hydrochloric acid and nitric acid, and etching the surface on which the metal film is deposited; a process of recovering the silicon substrate from the processing solution after predetermined time; and a process of cutting a remaining part left behind a region where micro grooves are substantially uniformly distributed. The silicon substrate having the high porosity surface layer is manufactured by the foregoing manufacturing method. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005268357(A) |
申请公布日期 |
2005.09.29 |
申请号 |
JP20040075583 |
申请日期 |
2004.03.17 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY |
发明人 |
AKINAGA HIROYUKI;SUN ZHI-GANG |
分类号 |
H01L21/306;H01L21/302;H01L21/3063;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/306 |
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