| 发明名称 |
Stack structure and method of manufacturing the same |
| 摘要 |
A stack structure is formed by stacking and bonding a plurality of substrates. The stack structure includes. Bonding films each of which is interposed in a bonding region between, adjacent glass substrates, and bonded to oxygen atoms in the glass of the substrate by anodic bonding.
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| 申请公布号 |
US2005212111(A1) |
申请公布日期 |
2005.09.29 |
| 申请号 |
US20050080272 |
申请日期 |
2005.03.14 |
| 申请人 |
CASIO COMPUTER CO., LTD. |
发明人 |
TERAZAKI TSUTOMU;NAKAMURA OSAMU;TAKEYAMA KEISHI;NOMURA MASATOSHI |
| 分类号 |
B01J19/00;B81B1/00;B81C1/00;H01M8/02;(IPC1-7):H01L21/00 |
主分类号 |
B01J19/00 |
| 代理机构 |
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| 主权项 |
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