发明名称 Metal gate semiconductor device and manufacturing method
摘要 A method for manufacturing a metal gate includes providing a substrate including a gate electrode located on the substrate. A plurality of layers is formed, including a first layer located on the substrate and the gate electrode and a second layer adjacent the first layer. The layers are etched to form a plurality of adjacent spacers, including a first spacer located on the substrate and adjacent the gate electrode and a second spacer adjacent the first spacer. The first spacer is then etched and a metal layer is formed on the device immediately adjacent to the gate electrode. The metal layer is then reacted with the gate electrode to form a metal gate.
申请公布号 US2005212015(A1) 申请公布日期 2005.09.29
申请号 US20040810950 申请日期 2004.03.25
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HUANG CHIEN-CHAO;CHEN KUANG-HSIN;YANG FU-LIANG
分类号 H01L21/28;H01L21/336;H01L21/82;H01L21/8234;H01L27/02;(IPC1-7):H01L21/336 主分类号 H01L21/28
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