| 摘要 |
PROBLEM TO BE SOLVED: To enhance the mounting density while reducing wiring layers to be used by determining a leading wire path from a part such that a crossing in connecting relation of wires caused by the direction of the part or the arrangement order of terminals can be solved. SOLUTION: Leading wire processing from a terminal of the part is executed prior to the overall wiring process. Further, to optimize the leading wire processing, the part connected to a wiring object is moved onto a virtual wiring board to perform the wiring processing. When the part is moved from an actual wiring board, the peripheral area of the part is cut out from the actual wiring board and moved onto the virtual wiring board. The part is arranged in an optimum state for wiring by rotating and parallel moving the direction of the part in an optimum direction on the virtual wiring board to determine the leading wire direction, and wiring between respective terminals is performed. Wiring information contained in the area cut out from the actual wiring board is returned from the virtual wiring board to the actual wiring board, whereby the leading wire processing is completed. Finally, wiring between parts is performed on the actual wiring board by use of the leading wire result obtained by the leading wire processing. COPYRIGHT: (C)2005,JPO&NCIPI
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