发明名称 AG ALLOY FILM AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an Ag alloy film which can yield an Ag alloy film pattern having high reflectivity and low resistance and having higher adhesion and a method for manufacturing the same. SOLUTION: The method has first and second thin film forming processes by sputter deposition and a simultaneous etching process for the first and second thin films and manufactures the thin films under the conditions to make the reflectivity of the second thin film higher than the reflectivity of the first thin film and to lower the resistance. The first thin film is sputter deposited by using an Ag alloy target prepared by adding 0.1 to 4.0wt% Au and 0.5 to 10.0wt% Sn to Ag and the second thin film is sputter deposited by using an Ag alloy target prepared by adding 0.1 to 4.0wt% Au and≤2.0wt% Sn to the Ag. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005264329(A) 申请公布日期 2005.09.29
申请号 JP20050041693 申请日期 2005.02.18
申请人 ULVAC SEIMAKU KK;ULVAC MATERIAL KK;ULVAC JAPAN LTD 发明人 YAMADA FUMIHIKO;KAWADA SUSUMU;OZAKI TOSHIHARU;HIRAMOTO TAKESHI;UKISHIMA YOSHIYUKI;ISHIBASHI AKIRA;KIN YUTAKA;SAITO SHIGERU
分类号 C23C14/14;C22C5/06;(IPC1-7):C23C14/14 主分类号 C23C14/14
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