COMPOSITE FINE PARTICLE, MANUFACTURING METHOD THEREFOR, AND FILM USING THE PARTICLE

摘要

PROBLEM TO BE SOLVED: To provide a composite fine particle having high transparency with the use of a semiconductor or an insulator, and to provide a manufacturing method therefor. SOLUTION: The composite fine particle comprises a fine particle of the semiconductor or the insulator with an average diameter of 2 to 100 nm, on the surface of which metallic superfine particles with an average diameter of 1 to 20 nm are combined through at least one coupling agent or a hydrolyzate. The method for manufacturing the composite fine particle comprises the steps of: adding at least one coupling agent to a dispersion containing the fine particles of the semiconductor or the insulator with an average diameter of 2 to 100 nm to react it with the fine particles of the semiconductor or the insulator; directly adding the metallic ultrafine particles, or adding a metal salt and a reducing agent to reduce the salt; and thereby combining the metallic superfine particles with the average diameter of 1 to 20 nm on the surface of the fine particles of the semiconductor or the insulator through the coupling agent or the hydrolyzate thereof. COPYRIGHT: (C)2005,JPO&NCIPI