发明名称 EXTENDED THIN FILM CAPACITOR (TFC)
摘要 Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.
申请公布号 US2005213281(A1) 申请公布日期 2005.09.29
申请号 US20040808489 申请日期 2004.03.25
申请人 INTEL CORPORATION 发明人 HE JIANGQI;SUN PING;KIM HYUNJUN;ZENG XIANG Y.
分类号 H01G4/228;H01L23/498;H01L23/50;H05K1/00;H05K1/03;H05K1/16;(IPC1-7):H01G4/228 主分类号 H01G4/228
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