Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material

摘要

The present invention provides a pattern forming method comprising bonding a compound to a substrate, the compound having both a polymerization initiating moiety capable of undergoing photocleavage to initiate radical polymerization and a substrate bonding moiety, contacting a radical-polymerizable unsaturated compound with the substrate, and exposing light thereto patternwise, so as to form a region where a graft polymer is generated and a region where a graft polymer is not generated. A conductive pattern forming method applying the pattern forming method, and a conductive pattern material obtained by the conductive film forming method.