| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide semiconductor device which is easily manufactured and reduced in size and thickness. <P>SOLUTION: The semiconductor device is provided with a substrate 1 including a cavity 2 at its front surface, a semiconductor chip stored within the cavity 2, and external connecting terminals 5, 6 connected to the semiconductor chip. In this semiconductor device, an electrode forming surface of the semiconductor chip is located in the electrode forming surface of the semiconductor chip, and in the side of the cavity forming surface where the cavity is formed. The external connecting terminals 5, 6 are located in the side of the cavity forming surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
