| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein, in the conventional method of bonding a plurality of bonding workpieces after cleaning their bonding surfaces with plasma under a low pressure, the workpieces facing each other to result in that cleaned substrate from one side re-adheres to the other side and needs a gap of about 50 mm at cleaning, causing the deviation at mounting. SOLUTION: The method comprises arranging the two bonding works facing each other but shifting to sideway offset positions enough to avoid overlapping their bonding surfaces in a low pressure chamber, cleaning both bonding surfaces with plasma, sliding them to their superposing position, and moving at least one work in the vertical direction to the bonding surface to bond them. This minimizes the gap between the works after the sliding, thus bonding them at a high mounting accuracy. COPYRIGHT: (C)2005,JPO&NCIPI |
