| 摘要 |
PROBLEM TO BE SOLVED: To provide a flux applying apparatus and its method which enable a sure soldering operation to be performed with high joining quality by enabling uniform application with a required quantity of flux inside a through hole as well as on the surface of a substrate and by preventing joining defects when a solder with a low fluidity and wettability such as a lead-free solder is used. SOLUTION: The flux applying apparatus 1 is equipped with a tank 2 for storing flux, one or more nozzles 5 for jetting the flux from an opening 5a facing upward, a pump 3 for supplying the nozzle(s) with the flux stored in the tank, and a substrate holding member 6 for holding a substrate 20. The substrate is brought into contact with the fluid level 40 of the flux jetted from the opening of the nozzle(s). COPYRIGHT: (C)2005,JPO&NCIPI |
