发明名称 HERMETIC SEAL PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a hermetic seal package capable of improving the reliability of hermetic seal without applying any complicated processing on a seal ring while preventing the rise of molten solder to a welded part. SOLUTION: The structure of cross section of the seal ring 1 is provided with an L-shape configuration wherein the upper part 11 as a projected unit is projected upward from the inside end of a lower part 12. The upper part 11 is smaller than the lower part 12 in the width thereof. Accordingly, heat generated upon welding the upper part 11 is hardly transferred to the lower part 12 and, therefore, solder 4 provided on the lower part 12 is prevented from remelting. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268526(A) 申请公布日期 2005.09.29
申请号 JP20040078648 申请日期 2004.03.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 KANEZUKA NORIHIKO;ISHIZAKI MITSUNORI;MURAKAMI MASAAKI
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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