| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor substrate from being irradiated with laser light even if there is irradiating laser light which is intense enough to cut or degenerate a metal thin-film resistance body during laser trimming processing. SOLUTION: The semiconductor substrate has an insulating film 15 formed on the semiconductor substrate 1 across other layers 3 and 5, the metal thin-film resistor 21 formed on the insulating film 15, and a laser light transmission preventive film 13 which is arranged between the semiconductor substrate 1 and insulating film 15 in an area below the metal thin-film resistor 21 and made of a metal material. Laser light 25 to irradiate the semiconductor substrate 1 during the laser trimming processing is reflected by the laser light transmission preventive film 13 to the opposite side from the semiconductor substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI
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