| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film used for molding a green sheet, which is used in production of various electronic parts such as a ceramic laminated condenser, a ceramic substrate and the like and compatible with a peeling process employing the so-called surface peeling system for peeling the green sheet in a vertical direction from a mold release surface. SOLUTION: The mold release film for molding the green sheet is a film, wherein a mold release layer is provided on one side of a polyester film and satisfies the formula: F(300 m/min)/F(30 m/min)≤2.0 and the formula: 0.01≤Si≤0.10 at the same time. In the formula of F(300 m/min)/F(30 m/min)≤2.0, F(300 m/min) and F(30 m/min) are the peeling forces (mN/cm) of the surface of the mold release layer from an acrylic pressure-sensitivce tape at peeling speeds of 300 m/min and 30 m/min and Si is the thickness (g/m<SP>2</SP>) of the mold release layer in the mold release film. COPYRIGHT: (C)2005,JPO&NCIPI
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