发明名称 PHOTOREACTIVE HOT MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a photoreactive hot melt adhesive, wherein a curing product produced after curing has extremely high degree of hardness and is unlikely to break because of having an excellent flexibility, and further, capable of preventing effectively a decrease of restoring force against creep deformation. SOLUTION: The photoreactive hot melt adhesive agent, wherein the curing product produced after curing has an elongation at break of≥100% at 60°C and the elongation at break is 1-10% at 23°C, both of which is measured by a method according to the method of JIS K 7113, and has a gel percentage of≥90%. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005264161(A) 申请公布日期 2005.09.29
申请号 JP20050042935 申请日期 2005.02.18
申请人 SEKISUI CHEM CO LTD 发明人 SASADA TETSUYA
分类号 C08G59/22;C09J11/00;C09J163/00;C09J201/00;(IPC1-7):C09J201/00 主分类号 C08G59/22
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