发明名称 EPOXY COMPOUND
摘要 PROBLEM TO BE SOLVED: To provide an epoxy compound that can provide an active energy ray hardenable composition that has high safety, excellent stability, shows excellent photocuring properties even under high humidity conditions and gives molded products having high strength film, good resistance to solvents and water. SOLUTION: This epoxy compound is represented by general formula (1) (wherein R<SB>100</SB>is a substituent, m0 is 0 to 2, r0 is 1 to 3, L<SB>0</SB>is a 1-15C chain which may include O or S atom in the main chain linking group having a valency of r0 + 1 monovalent or single bond). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005263811(A) 申请公布日期 2005.09.29
申请号 JP20050145191 申请日期 2005.05.18
申请人 KONICA MINOLTA HOLDINGS INC 发明人 SASA NOBUMASA
分类号 C07D303/16;C07D303/27;C07D303/48;C07D407/12;C07D409/12;C08G59/20;(IPC1-7):C07D303/16 主分类号 C07D303/16
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