| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in adhesion to a substrate, flame retardancy, and resistance to soldering stress, without using a bromine-containing organic compound, nor an antimony compound. SOLUTION: This epoxy resin composition for sealing a semiconductor contains (A) an epoxy resin expressed by general formula (1) (R1 and R2 are identical to or different from each other and are each a 1-4C alkyl; a is an integer of 0 to 3; b is an integer of 0 to 4; and n is an average value comprising a positive number of 1 to 5), (B) a phenol resin expressed by general formula (2), (C) an inorganic filler, (D) a curing accelerator, and (E) N-N'-diphenylthiourea as essential components, wherein inorganic materials are contained in an amount of not less than 84 wt.% and not more than 94 wt.% as a whole based on a total amount of the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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