| 发明名称 |
RESIN COMPOSITION FOR FORMING BUMP, BILAYER LAMINATED FILM FOR BUMP FORMATION AND METHOD FOR FORMING BUMP |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative radiation-sensitive bilayer laminated film for bump formation, the film having excellent printability of a solder paste and a pattern profile and being easily peelable from a substrate, and to provide a method for producing a bump by using the film. <P>SOLUTION: A resin composition containing (A) a polymer having a structural unit expressed by general formula (1) and (B) an organic solvent is used as an underlayer of the bilayer laminated film for bump formation. The negative radiation-sensitive bilayer laminated film for bump formation is manufactured and is used to form a bump. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005266795(A) |
申请公布日期 |
2005.09.29 |
| 申请号 |
JP20050040827 |
申请日期 |
2005.02.17 |
| 申请人 |
JSR CORP |
发明人 |
NISHIMURA YOKO;OTA KATSU;INOMATA KATSUMI;IWANAGA SHINICHIRO |
| 分类号 |
G03F7/11;G03F7/004;G03F7/033;G03F7/40;H01L21/60 |
主分类号 |
G03F7/11 |
| 代理机构 |
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