| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the structure of a semiconductor chip which is excellent in pressure balance upon mounting of the semiconductor chip and which reduces the area of the semiconductor chip without any additional process in the structure of the semiconductor chip. <P>SOLUTION: In the structure of the semiconductor chip 3 including a control/power supply line 14 of the semiconductor chip 3 formed on a glass substrate, connection terminals 22 for electrical connection with the control/power supply line 14 are provided alongside in a longitudinal direction of the semiconductor chip 3, whereby the length of the wiring in the semiconductor chip 3 can be restrained to the minimum. Since the wiring length is reduced, the width of the wiring in the semiconductor chip 3 is made thin to reduce the area of the semiconductor chip 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
