发明名称 JOINING METHOD WITH Au-Sn BASED BRAZING FILLER METAL
摘要 PROBLEM TO BE SOLVED: To provide a joining method to apply Au-Sn based brazing filler metal in which generation of Au-rich phase is completely suppressed, and a homogeneous joined part can be formed with higher probability. SOLUTION: In the method for joining a work with Au-Sn based brazing filler metal, the composition and the thickness of the Au-Sn based brazing filler metal are adjusted so that the Sn concentration, by weight, of a joined part after the joining is 20.65-23.5%. The present invention is completed by finding out that the true eutectic point of the alloy system is 20.65% Sn. In a means to adjust the composition of the joined part, the composition, the thickness or the volume of the brazing filler metal must be adequately changed according to the thickness of a gold-plated layer. The relationship between the thickness of the brazing filler metal and the thickness of the gold-plating is shown for the brazing filler metal with 21-25% Sn. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005262317(A) 申请公布日期 2005.09.29
申请号 JP20050041948 申请日期 2005.02.18
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 MIYAZAKI KENICHI;SHIMADA TOMOHIRO
分类号 B23K1/00;B23K1/20;B23K35/30;B23K101/40;C22C5/02;H01L23/02;(IPC1-7):B23K35/30 主分类号 B23K1/00
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