发明名称 MANUFACTURING METHOD OF PHOTOELECTRIC WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a photoelectric wiring board with which an optical waveguide which penetrates an electric wiring board is easily formed and propagation loss of light in the optical waveguide is suppressed. SOLUTION: The manufacturing method of the photoelectric wiring board includes a process for forming wiring on the board surface, a process for removing a part of the board so that the board has the desired shape and size and forming a through hole, a process for simultaneously forming a clad projection part and a first clad of optical wiring, a process for simultaneously forming a core projection part and a core of the optical wiring and further forming an optical conversion means in the core and a process for forming a second clad of the optical wiring. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005266119(A) 申请公布日期 2005.09.29
申请号 JP20040076684 申请日期 2004.03.17
申请人 SHARP CORP 发明人 IWAI YOSHIFUMI
分类号 G02B6/42;G02B6/122;G02B6/13;H01L27/14;H05K1/02;(IPC1-7):G02B6/13 主分类号 G02B6/42
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