| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of a chip and a crack in a wafer concerning a clamp ring for clamping the periphery of a semiconductor substrate which is laid on a mounting stand and which has an orientation flat or a notch. SOLUTION: The clamp ring has, at a portion other than a portion corresponding to a notch portion or the end portion of an orientation flat portion at least of a semiconductor substrate, an inclined plane 24 which is in contact with the periphery of the semiconductor substrate and which adjusts the position of the semiconductor substrate on a mounting stand. The clamp ring has, at a portion including the portion corresponding to the notch portion or the end portion of the orientation flat portion at least, a non-interfering portion in the shape by which interference with the end of the orientation flat or the notch is avoided. COPYRIGHT: (C)2005,JPO&NCIPI |
