| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a multi-layered circuit substrate for suppressing the deviation of each layer at the time of lamination pressing in the multi-layered circuit substrate. SOLUTION: The manufacturing method of the multi-layered circuit substrate having a process for forming a laminated body where a plurality of circuit substrates and an inter-layer adhesive are laminated, a process for temporarily bonding the laminate body, and a process for heating and pressurizing the laminated body, wherein the adhesive at a reference mark section for temporarily bonding the circuit substrate and adhesive provided at the peripheral section of the circuit substrate in the process of the temporary bonding is almost completely hardened. COPYRIGHT: (C)2005,JPO&NCIPI |
