| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board which can hold the roundness state of a circuit formation reference hole, and can improve position accuracy of interlayer connection and position accuracy of a circuit of an outer layer and an inner layer. SOLUTION: The method is for manufacturing the multilayer printed wiring board with a via connecting at least a wiring layer. The outer layer of an insulating substrate is irradiated with laser and a non-through hole is shaped. After the circuit formation reference hole is shaped, the non-through hole is subjected to conducting processing without performing desmear and metal plating treatment for the circuit formation reference hole. COPYRIGHT: (C)2005,JPO&NCIPI |
