Surface-mountable semiconductor component and method for producing it

摘要

Surface-mountable semiconductor component having a semiconductor chip ( 1 ), at least two external electrical connections ( 31/314/41, 32/324/42 ), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip ( 1 ), and an encapsulation material ( 50 ). The two external electrical connections are arranged at a film ( 2 ) having a thickness of less than or equal to 100 mum. The semiconductor chip ( 1 ) is fixed at a first main surface ( 22 ) of the film ( 2 ) and the encapsulation material ( 50 ) is applied on the first surface ( 22 ).