MOLDING OF RESIN FOR CUTTING OPERATION, MATERIAL FOR FORMATION THEREOF AND MODEL

摘要

A molding of resin for cutting operation that exhibits a charge quantity half-life period of 1 to 60 sec and a water content of 0.05 to 1.0 wt.%; and a model obtained by subjecting the molding to cutting operation. Further, there is provided a material for formation of resin for cutting operation, comprising hardening resin component (A) and nonsilicon surfactant (B). This material for formation of resin for cutting operation enables avoiding any adverse effect of cutting powder or dust occurring at cutting operation on electronic control circuits of processing machines, thereby avoiding malfunctioning or sudden stop of such processing machines. Still further, there is provided a molding of resin for cutting operation produced from the above resin formation material, and provided a model obtained by subjecting the molding to cutting operation.