| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor element in which a load operated upon an electrode pad can be reduced by applying a bump bonding load without being affected by the aperture diameter of the electrode pad. <P>SOLUTION: As the configuration of a semiconductor element 11 with a bump 14 formed on an electrode pad 12, the bump 14 has the double layer structure of a first bump layer 15 and a second bump layer 16, and the area of a first bonding plane 15 formed on the first bump layer 15 in the distal end of the bump is set smaller than that of a second bonding plane 18 formed on the second bump layer 16, so as to be bonded with the electrode pad 12 in the proximal end of the bump. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
