发明名称 MULTILAYERED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multilayered circuit board excellent in assembling workability and repeated bending reliability with a stable quality by a simple manufacturing method. SOLUTION: In the multilayered circuit board, a flexible part is connected with a rigid part through an adhesive layer, and the flexible part is extended from the end of the rigid part. Further, the adhesive layer is recessed from the end of the rigid part. In addition, a method is provided for manufacturing the multilayered circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268413(A) 申请公布日期 2005.09.29
申请号 JP20040076494 申请日期 2004.03.17
申请人 SUMITOMO BAKELITE CO LTD 发明人 HASHIMOTO OSAMU
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/02
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