| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate in which a degree of freedom in design is high and which can form a desired protecting plating film and can cope with narrowing of a wiring conductive layer. SOLUTION: In the multilayer wiring substrate, wiring conductive layers 3 and insulating layers 2 composed of resin are alternately laminated on an insulating substrate 1 by a plurality of layers, and the wiring conductive layers 3 located vertically are electrically connected to each other through a through conductor 4 formed in the insulating layers 2 therebetween. A surface wiring conductive layer 3' is formed on a surface of the insulating layer 2 of an outermost layer. In the multilayer wiring substrate, on the surface of the insulating layer 2 of the outermost layer, resin protection layers 7 formed with a metal protection layer 6 so as to clog a through hole 10 are laminated in the through hole 10 formed in a region overlapped on the surface wiring conductive layer 3', which is joined to the metal protection layer 6. COPYRIGHT: (C)2005,JPO&NCIPI |
