发明名称 |
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a memory device with low power consumption and high electron injection efficiency in a charge storing layer. SOLUTION: The memory device comprises a semiconductor substrate, a first impurity region and a second impurity region formed respectively by doping an impurity into the semiconductor substrate, and a gate structure formed on the substrate between the first impurity region and the second impurity region. The gate structure comprises a dielectric layer including the charge storing layer and a gate electrode, and the dielectric layer is formed asymmetrically. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005268808(A) |
申请公布日期 |
2005.09.29 |
申请号 |
JP20050082020 |
申请日期 |
2005.03.22 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
HAN JEONG HEE;CHAE SOO-DOO;JEON SANGHUN |
分类号 |
H01L21/8247;H01L21/28;H01L21/8239;H01L27/105;H01L27/115;H01L29/423;H01L29/788;H01L29/792;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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