| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional packaging structure enabling high-density, high-functionality mounting, facilitating the inspection, repair and exchange of each element, and making the packaging area compact. SOLUTION: A three-dimensional packaging structure comprises: a first main wiring board (11), having a first wiring pattern on a surface and an electronic component (30) packaged in a part of the wiring pattern; a second main wiring board (12), arranged opposite to the first main wiring board and having a second wiring pattern on the surface; and a lead frame type connector (20) arranged substantially vertical with respect to both the wiring boards at the end parts of the first main wiring board and the second main wiring board. The lead frame type connector has a plurality of leads (21), each comprising a conductive material, and a resin portion (22) fixing them. Each end part is exposed from the resin portion. At least two leads are electrically connected with the first wiring pattern of the first main wiring board and the second wiring pattern of the second main wiring board, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
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