发明名称 DIELECTRIC FILM FORMING COMPOSITION AND METHOD OF MANUFACTURING DIELECTRIC FILM
摘要 PROBLEM TO BE SOLVED: To provide a dielectric film forming composition which can form a silicone based film having an adequate uniform thickness suited for an interlayer dielectric used for a semiconductor device, etc. and is superior in dielectric characteristics, especially, CMP durability, and to provide its manufacturing method or the like. SOLUTION: The dielectric film forming composition contains a condensate of a compound shown by the general formula (I), its hydrolyte or its condensate. In the formula, R<SP>1</SP>-R<SP>7</SP>are organic groups and may be mutually equal or different. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268767(A) 申请公布日期 2005.09.29
申请号 JP20050039183 申请日期 2005.02.16
申请人 FUJI PHOTO FILM CO LTD 发明人 MORITA KENSUKE;ADEGAWA YUTAKA
分类号 C09D5/25;C08G77/04;C09D183/04;C09D183/08;H01L21/312;(IPC1-7):H01L21/312 主分类号 C09D5/25
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