摘要 |
PROBLEM TO BE SOLVED: To provide a dielectric film forming composition which can form a silicone based film having an adequate uniform thickness suited for an interlayer dielectric used for a semiconductor device, etc. and is superior in dielectric characteristics, especially, CMP durability, and to provide its manufacturing method or the like. SOLUTION: The dielectric film forming composition contains a condensate of a compound shown by the general formula (I), its hydrolyte or its condensate. In the formula, R<SP>1</SP>-R<SP>7</SP>are organic groups and may be mutually equal or different. COPYRIGHT: (C)2005,JPO&NCIPI
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