| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit structure which can suppress heat from being confined therein. SOLUTION: In the circuit structure, a control circuit is formed on one surface of a circuit board 18 by a printed wiring means, and a relay 11 controlled by the control circuit is mounted on one surface of the circuit board. A metallic conductive path 13B (heat transfer layer) is formed on the other surface of the circuit board 18 by the printed wiring means. A lower case 50 also as a heat irradiating member is adhered to the conductive path 13B via an adhesive sheet 16 disposed therebetween. Since the conductive path 13B (heat transfer layer) enables heat generated in the relay 11 mounted on one surface of the circuit board 18 to be quickly transmitted to the other surface of the circuit board 18, heat confinement in the rcircuit structure 10 can be suppressed. COPYRIGHT: (C)2005,JPO&NCIPI
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