| 摘要 |
PROBLEM TO BE SOLVED: To reduce apparatus running costs for the exchange of an entire partition wall in the apparatus which performs treatment on a substrate disposed in a substrate treatment space, by separating the inside of a vacuum reaction chamber into a plasma discharge space and the substrate treatment space using the partition wall having a plurality of through holes through which radicals are passed, and by leading the radicals generated in the plasma discharge space through the plurality of through holes on the partition wall into the substrate treatment space. SOLUTION: The problem is solved by forming a partition wall of a partition wall body comprising a plurality of through holes, and of a control plate which is disposed on the partition wall body at the side of a plasma generating space and includes radical pass holes at positions corresponding to the through holes provided on the partition wall body. COPYRIGHT: (C)2005,JPO&NCIPI
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