| 摘要 |
PROBLEM TO BE SOLVED: To provide a product formed by punching it from a flexible circuit board at high productivity and low costs. SOLUTION: A wiring pattern 12 formed by a conductive layer is formed on one surface of the base material film 11 of the flexible circuit board. The wiring pattern is formed so that circuits 15 each of which is a constitution unit are formed, for instance, in each fixed interval. A resin material into which granular additives having a suitable size are mixed is applied to the surface of the wiring pattern 12 by screen printing, the resin material is cured and then a cover coat layer 16 for protecting the wiring pattern 12 is formed on the wiring pattern 12 in a rough surface state. Since the surface of the cover coat layer 16 is roughened, a contact area in which the pressing surface of an upper clamper 21a directly comes into contact with the cover coat layer 16, is set at below 50% of the opposite area of the pressing surface opposed to the cover coat layer 16, when the pressing surface is pressed and fixed to the cover coat layer 16. COPYRIGHT: (C)2005,JPO&NCIPI
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