| 摘要 |
PROBLEM TO BE SOLVED: To provide at a low cost an adhesive tape for fixing a semiconductor, which causes few stain of an adherend, shows a small change in physical properties of adhesion over time and a high antistatic performance and has little effect on a circuit surface even in a dicing or a back grinding treatment of a semiconductor part. SOLUTION: The adhesive tape for fixing the semiconductor comprises a substrate film (15) and an adhesive layer. The adhesive layer (12-14) is composed of at least three layers and contains an antistatic layer (13) just beneath the outermost layer (12). COPYRIGHT: (C)2005,JPO&NCIPI
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