ASSEMBLY AND ADHESIVE LAYER FOR SEMICONDUCTOR COMPONENTS

摘要

The invention relates to an assembly and adhesive layer for semiconductor components, arranged between a silicon support (submount) and an electronic functional element, for formation of an electrically-conducting connection between the silicon support and the functional element, whereby the assembly and adhesive layer is arranged on the support. The aim of the invention is the production of an assembly and adhesive layer for semiconductor components for the production of electrical connections to support elements, which can be particularly easily produced and which securely avoid the generation of an electrochemical voltage. The above is achieved, whereby the assembly and adhesive layer is made from a Ti/TiN layer (6), applied to an aluminium contact surface (5) of the silicon support (1), by means of a deposition method and the aluminium contact surface (5) is located on a landing pad (2) on the silicon support (1).