| 摘要 |
A method for forming a photoresist layer on a substrate to improve the joining of the photoresist layer and the substrate is provided. For a bumping process using the method, a liquid is used to react with the photoresist layer to form a combination layer of good fluidity between the photoresist layer and the passivation layer on the substrate. The combination layer fills the pits of the passivation layer to improve the joining of the photoresist layer and the passivation layer. Therefore, when the solder material is filled into the openings, no solder material stays between the photoresist layer and the passivation layer, so as to avoid solder bridging between the two adjacent pads. |
