发明名称 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION METHOD OF FORMING CURED ARTICLE AND METHOD OF PRODUCING FUNCTIONAL DEVICE
摘要 There is provided a photosensitive thermosetting resin composition used for producing a permanent film, capable of forming a resin layer which is excellent in fluidity upon heat bonding after pattern, formation and also has excellent adhesion as well as bonding properties and/or sealing properties. This composition contains a reaction product of (A) an alkali soluble resin and (C) a 10 crosslinking polyvinyl ether compound, (B) a compound generating an acid under irradiation with radiation, and (D) an epoxy resin.
申请公布号 WO2005052688(A3) 申请公布日期 2005.09.29
申请号 WO2004JP17533 申请日期 2004.11.18
申请人 TOKYO OHKA KOGYO CO., LTD.;TAKAHASHI, TORU;KATSUMATA, NAOYA;MAEDA, HIROKI 发明人 TAKAHASHI, TORU;KATSUMATA, NAOYA;MAEDA, HIROKI
分类号 G03F7/004;G03F7/032;G03F7/039;H05K1/00;H05K3/28 主分类号 G03F7/004
代理机构 代理人
主权项
地址