发明名称 |
CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION METHOD OF FORMING CURED ARTICLE AND METHOD OF PRODUCING FUNCTIONAL DEVICE |
摘要 |
There is provided a photosensitive thermosetting resin composition used for producing a permanent film, capable of forming a resin layer which is excellent in fluidity upon heat bonding after pattern, formation and also has excellent adhesion as well as bonding properties and/or sealing properties. This composition contains a reaction product of (A) an alkali soluble resin and (C) a 10 crosslinking polyvinyl ether compound, (B) a compound generating an acid under irradiation with radiation, and (D) an epoxy resin. |
申请公布号 |
WO2005052688(A3) |
申请公布日期 |
2005.09.29 |
申请号 |
WO2004JP17533 |
申请日期 |
2004.11.18 |
申请人 |
TOKYO OHKA KOGYO CO., LTD.;TAKAHASHI, TORU;KATSUMATA, NAOYA;MAEDA, HIROKI |
发明人 |
TAKAHASHI, TORU;KATSUMATA, NAOYA;MAEDA, HIROKI |
分类号 |
G03F7/004;G03F7/032;G03F7/039;H05K1/00;H05K3/28 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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